Guangli Technology: 12-inch laser grooving machine and 12-inch grinding machine are currently undergoing validation on the customer end.

Guangli Technology recently stated at an investor conference call that their 12-inch high-precision cutting equipment, model 8231, is suitable for ultra-thin wafers, supports full wafer cutting and DBG half-cutting processes, and can be used in scenarios such as CPO-co-packaged optics, power center data interconnection, and compact packaging for wearable devices. Both the 8231 and the 7260, which is used for efficient packaging body cutting and sorting, have entered the customer verification stage. In addition, the 12-inch laser grooving machine and 12-inch grinding machine are also in the customer verification stage with positive feedback. The company is also accelerating the development progress of the 8-inch laser scribing machine and grinding and polishing integrated machine, aiming to quickly advance equipment verification and generate sales orders as soon as possible.