Fudan team developed "Fiber Chips" expected to provide key support for future industries such as brain-machine interfaces.

Building high-density integrated circuits in fibers thinner than a hair? This bold idea has now become a reality. The team of Peng Huisheng and Chen Peining from the Fiber Electronic Materials and Devices Research Institute and the Department of Polymer Science at Fudan University has successfully developed the "fiber chip", which has information processing capabilities comparable to some classic commercial chips. It also has unique advantages of high flexibility, adaptability to complex deformations such as stretching and twisting, and can be woven, making it promising for future industries such as brain-computer interfaces, electronic textiles, virtual reality, and providing crucial support. On January 22 at midnight, Beijing time, this original achievement that breaks the traditional silicon-based chip paradigm was published in the prestigious academic journal "Nature".