Our country has made progress in the research of liquid metal flexible electronic manufacturing, showing application prospects in fields such as aerospace intelligent systems.

Today, the official website of the Chinese Academy of Sciences announced that recently, teams from the Institute of Chemistry and Physical Technology of the Chinese Academy of Sciences have made a series of advancements in the field of flexible electronics manufacturing using liquid metal, providing innovative technological solutions for the high performance, environmental friendliness, and large-scale application of flexible electronics. The team proposed a non-destructive etching patterning technology, breaking through the inherent bottlenecks of traditional additive and subtractive manufacturing processes. This technology controls the adhesion of liquid metal to the substrate in an ethanol environment, combined with local mechanical force from a needle tip, precisely peeling off semi-liquid metal to achieve material-free circuit patterning with a resolution of 5m, compatible with eight types of rigid and flexible substrates such as PDMS, paper, and biological tissue skin. The team also proposed a shape-adaptive conformal electronic fabrication technology, overcoming the manufacturing challenges of 3D curved surface electronic devices. Both achievements are based on the development of semi-liquid metal materials and breakthroughs in interface control mechanisms, respectively solving the two major pain points of flexible electronics manufacturing, "high-precision non-destructive manufacturing" and "3D curved surface adaptation," covering the entire chain of innovation from basic research, process development to device applications. This achievement promotes theoretical innovation in the field of liquid metal materials and flexible electronic manufacturing technology, showing potential applications in wearable health monitoring, implantable diagnostic devices, aerospace intelligent systems, and other fields.