Changdian Technology: Completes the issuance of 2.4 billion yuan in technology innovation bonds.

Changdian Technology announced that the company had previously obtained the approval of the dealers association to register and issue 4.8 billion yuan in medium-term notes with a validity period of 2 years. Recently, the company completed the issuance of the first tranche of 2025 technology innovation bonds. The bond has a term of 5+5 years, with an interest start date of December 26, 2025, and a maturity date of December 26, 2035. The planned and actual total issuance amount is 2.4 billion yuan, with an issuance interest rate of 2%. The lead underwriter is Bank of Communications, and the joint lead underwriters are Industrial and Commercial Bank of China and Industrial Bank.