CSRC Bond Department: Cumulative issuance of sci-tech innovation bonds has exceeded 2 trillion yuan.

Huang Jianshan, Deputy Director of the Bond Department of the China Securities Regulatory Commission, stated at a news conference on financial support to accelerate the construction of the Western Land and Sea New Passage that since the introduction of technology innovation bonds in 2021, a total of over 2 trillion yuan of sci-tech innovation bonds have been issued, with enterprises in provinces along the route issuing over 260 billion yuan of sci-tech innovation bonds.