Li Ang Wei: 12-inch silicon wafers have entered the supply chain of some storage chip customers.

During a research conducted by Lingang Microelectronics, it was stated that the production capacity of the existing 12-inch heavy doping series silicon wafers is rapidly increasing, with a current capacity utilization rate of about 80%. The company's 12-inch silicon wafers already cover logic circuits and storage circuits of 14nm and above technology nodes, as well as image sensor components and power devices required by customers, and have entered the supply chain of some storage chip customers. The company's light doping polished wafer product series will focus on leveraging the company's epitaxial technology expertise and developing key products such as BCD light doping boron silicon wafers and CIS light doping boron silicon wafers, and will focus on the research and development of light doping silicon wafers for advanced processes, placing more emphasis on the technical strength and quality standards of the products, while the company does not actively participate in price wars.