Fangbang Stock: The company can continuously obtain small batch production orders for copper stripping.

date
16/12/2025
Investors are asking Fangbang Corporation on the interactive platform whether there are samples of copper foil for testing advanced packaging technology. Fangbang Corporation replied that currently, the company has been able to peel copper and has successfully passed mass production verification with some representative PCB manufacturers and related top chip terminal customers, continuously receiving small batch production orders. Peelable copper is the basic material for preparing chip substrate with the mSAP process. The CoWoP process has not yet been implemented and has not become the mainstream packaging technology route. The company will closely cooperate with relevant downstream partners to promote related testing work.