Epoxy Base Electronic Material Corporation (603002.SH): Plans to invest approximately RMB 270 million to build an advanced packaging film material (GBF) project

Epoxy Base Electronic Material Corporation (603002.SH) announced that the company has signed a "Project Investment Agreement" with the Zhuhai Economic and Technological Development Zone Management Committee to invest in the construction of a new "Advanced Packaging Film Material (GBF) Project." The project investment amount is approximately RMB 270 million, of which fixed asset investment is approximately RMB 220 million. The project implementation entity is Zhuhai Epoxy Base Electronic Material Corporation Materials Co., Ltd., a wholly-owned subsidiary of the company. The project construction period is 24 months. If the investment project is successfully implemented in the future, the company's advanced packaging film material (GBF) will achieve large-scale supply, which can effectively increase the proportion of high-value-added new material business and have a positive impact on the company's future development.