Huatai (06886): "25Huatai Sci-Tech Innovation Bond 01A" will pay interest on September 22.
Huatai Securities (06886) issued an announcement. To ensure the smooth progress of the interest payment work for Huatai Securities Co., Ltd. 2025 Sci-Tech Innovation Bond (First Tranche) (Type One) (bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, bond code: 342580006.IB), and to facilitate investors in receiving interest payment funds in a timely manner, the relevant matters are hereby announced as follows: Bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, total issue amount: RMB 300 million, bond interest rate for this interest calculation period: 1.66%, interest payment date: September 22, 2026.
Huatai (06886) issued an announcement stating that, to ensure the smooth progress of the interest payment for Huatai Co., Ltd. 2025 Sci-Tech Innovation Bond (First Tranche) (Type I) (bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, bond code: 342580006.IB) and to facilitate investors in receiving interest payment funds in a timely manner, the relevant matters are hereby announced as follows: Bond abbreviation: 25Huatai Sci-Tech Innovation Bond 01A, total issue amount: RMB 300 million, interest rate of this interest calculation period: 1.66%, interest payment date: September 22, 2026.
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