New Stock News | Shenzhen Kinwong Electronic (603228.SH) passes HKEX hearing to become the world's largest automotive electronic PCB supplier.

According to a disclosure by the Hong Kong Stock Exchange on September 7, Shenzhen Kinwong Electronic Co., Ltd. (abbreviated as: Shenzhen Kinwong Electronic (603228.SH)) has passed the listing hearing for the main board of the Hong Kong Stock Exchange, with CITIC SEC, Bank of America Securities, and Guolian Securities International as joint sponsors. The prospectus shows that Shenzhen Kinwong Electronic is a globally renowned manufacturer of printed circuit board (PCB) products. The company's PCB products provide a connected foundation for global customers in automotive electronics, communication and data infrastructure, smart devices, and industrial control. With its PCB products and intelligent manufacturing capabilities, the company has become one of the leading suppliers in the global automotive electronics PCB industry and a core component supplier for AI computing infrastructure. Leveraging its leading technological advantages in high-end HDI and high-layer PCB fields and a long-term oriented approach to high-end production capacity, the company can meet the diverse needs of global customers and seize important growth opportunities in the AI era. According to data from Frost & Sullivan, based on revenue in 2025, the company is the largest automotive electronics PCB supplier worldwide, with a market share of 10.6%, and ranks eleventh among global PCB suppliers with a market share of 2.5%. Eight of the top ten Tier 1 automotive suppliers globally are customers of the company, and its PCB products are widely used in the automotive products of the world's top ten automotive groups. The company is one of the few manufacturers providing PCB products to leading enterprises in the global AI computing infrastructure. It has mass-produced high-end PCBs that can be applied in the fields of AI computing infrastructure, including high-layer multi-layer PCBs with over 40 layers, 6-stage 22-layer HDI PCBs, 14-layer HDI PCBs using mSAP technology, and multi-layer PTFE FPCs. The company has manufacturing capabilities for high-layer multi-layer PCBs with over 70 layers, 9-stage 28-layer HDI PCBs, 12-layer any-layer rigid-flex boards, and high-speed FPCs. The company has also initiated the customer certification process for 11-stage HDI PCBs. The company's 9-stage HDI PCBs received customer certification within just 90 days, highlighting its technological maturity and product reliability in the AI infrastructure field. In the fiscal years of 2023, 2024, and 2025, and for the four months ending April 30, 2026, the company achieved revenues of approximately 10.757 billion, 12.659 billion, 15.308 billion, 4.534 billion, and 5.341 billion RMB, respectively; during the same periods, profits were approximately 911 million, 1.160 billion, 1.244 billion, 424 million, and 317 million RMB, respectively.