New Stock News | Tongbo Technology Resubmits Application to Hong Kong Stock Exchange

According to the disclosure by the Hong Kong Stock Exchange on August 31, Jiangxi Tongbo Technology Co., Ltd. (abbreviated as: Tongbo Technology) has once again submitted a listing application to the main board of the Hong Kong Stock Exchange, with Sinolink (Hong Kong) as its exclusive sponsor. According to the prospectus, the company is a provider of electrolytic copper foil solutions in China, focusing on the design, research and development, production, and sales of high-performance electrolytic copper foil. Based on information from Frost & Sullivan, by sales volume in 2025, the company is the tenth largest producer of electrolytic copper foil in the world, with a market share of approximately 2.3%.