New Stock News | Nazhen Technology passes Hong Kong Stock Exchange hearing, ranking fifth with a 4% share in the global optical module market.

date
07:00 31/08/2026
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GMT Eight
According to the Hong Kong Stock Exchange's disclosure on August 30, Nazhen Technology Company (abbreviated as: Nazhen Technology) has passed the listing hearing for its main board listing on the Hong Kong Stock Exchange, with Citibank and CITIC Securities serving as its joint sponsors.
According to the Hong Kong Stock Exchange disclosure on August 30, Nazhen Technology Company (referred to as: Nazhen Technology) has passed the listing hearing on the main board of the Hong Kong Stock Exchange, with Citibank and CITIC SEC serving as its joint sponsors. The prospectus shows that Nazhen Technology is a mature supplier of optical communication and optical connection products, dedicated to the research, development, manufacturing, and sales of optical modules, optical chips, and optical network terminals, providing services to domestic and international customers. In 2025, based on global optical module revenue, the company holds a 4.0% market share, ranking fifth among all professional optical module manufacturers globally; based on China's optical module revenue, the company holds a 10.1% market share, ranking third among all professional optical module manufacturers globally. The company is also one of the few in the world that possesses both R&D and manufacturing capabilities for optical modules and optical chips. The company holds 1,581 patents and has 716 patent applications under review globally. It is an initiator or member of 18 industry standardization organizations and participates in the formulation of 61 industry standards. With a cross-regional R&D network in Qingdao, Wuhan, Silicon Valley, and Singapore, the company has accumulated core technologies and products covering all major links in the optical communication value chain. In the field of optical module products, the company possesses exclusive capabilities in circuit design and core packaging technologies, including Transistor Outline (TO-CAN), BOX, Chip-On-Board (COB), and Silicon Photonics packaging technologies. In the area of optical chip design, the company has successfully developed two mature processing platforms for buried heterostructure and rib waveguides. The company also has proprietary capabilities to develop various optical network terminal products. Currently, the company has four manufacturing bases in Qingdao, Jiangmen, Thailand, and the United States. In 2023, 2024, 2025, and for the six months ended June 30, 2026, the optical module utilization rate at the Qingdao base was 61.5%, 76.2%, 76.0%, and 65.6%, respectively, while the optical chip utilization rate was 68.2%, 42.7%, 72.2%, and 94.1%; the optical module utilization rate at the Jiangmen base was 64.1%, 84.9%, 83.4%, and 76.3%, respectively, and the utilization rate of optical network terminals was 76.5%, 74.0%, 72.6%, and 75.9%; the optical module utilization rate at the Thailand base was 37.1%, 68.3%, 65.0%, and 69.6%. The company is upgrading and expanding its optical module and optical chip manufacturing bases in China, Thailand, and the United States. The company also plans to establish a new R&D and manufacturing base in Xiamen, focusing on the research and production of high-end laser chips. In terms of finances, for the fiscal years 2023, 2024, and 2025, as well as for the six months ended June 30, 2026, the company achieved revenues of approximately RMB 4.239 billion, RMB 5.087 billion, RMB 8.355 billion, and RMB 5.393 billion, respectively; during the same periods, profits were approximately RMB 216 million, RMB 89.49 million, RMB 873 million, and RMB 661 million.