Three stocks, including HESAI-W(02525), have been included in the list of Hong Kong Stock Connect under the Shanghai and Shenzhen Stock Connect.
Hosa International Limited (02525), S.Bond Technology (03661), and Chipbond Technology Corporation (09630) have been included in the list of eligible stocks under the Shanghai-Hong Kong Stock Connect and Shenzhen-Hong Kong Stock Connect.
On July 24th, the Shenzhen Stock Exchange announced that the list of securities eligible for the Hong Kong Stock Connect has been adjusted, with HESAI-W (02525), SG Micro Corp (03661), and Circuit Fabology Microelectronics Equipment (09630) being added. This adjustment will take effect on July 24th, 2026. Similarly, the Shanghai Stock Exchange announced on July 23rd that the three stocks mentioned above will also be included in the Shanghai-Hong Kong Stock Connect starting from today.
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