World and Gene, World Vision Communication, Weijia Technology Science and Technology Innovation Board IPO "has been inquired"

The official website of the Shanghai Stock Exchange shows that Shihe Genetics, Shiweitong, and Weijia Technology's Science and Technology Innovation Board IPO review status has been updated to "inquiry received". According to the prospectus, Shihe Genetics is a high-throughput gene sequencing technology company specializing in clinical applications. It mainly conducts gene testing for tumor patients, guiding clinical drug selection through clear gene typing, suggesting drug resistance mechanisms, monitoring postoperative recurrence, and exploring early screening and diagnosis for high-risk populations. It is a high-tech enterprise that provides molecular diagnostic services and products for precision oncology. As of the end of the reporting period, the company has had four products approved for listing and is advancing on nine core pipeline projects. It is currently the only company in the domestic gene testing industry to be selected for the Innovative Medical Management Device Special Review Program four times. Shiweitong is a national-level specialized and new enterprise focusing on the research and production of optoelectronic devices and sensors. Its main products include optoelectronic integrated devices and components, as well as strong electromagnetic environment fiber-optic current sensors. The Y-waveguide modulator is the company's main product in the field of optoelectronic integrated devices and components. Weijia Technology is dedicated to the research, development, manufacturing, and sales of key equipment in the electronic packaging field. Its products include PCB specialized equipment and integrated circuit sealing and testing equipment. It has gradually expanded its product layout to cover multi-level and multi-system product packaging from board-level packaging (level two packaging) to component-level packaging (level one packaging), and it is gradually extending towards chip-level packaging (level zero packaging). Its products are widely used in the core processes of high-density printed circuit boards, integrated circuits, and other electronic components, with terminal applications covering national strategic emerging industries such as artificial intelligence, AI computing power, data centers, and 5G/6G communication.