Yueya Semiconductor's ChiNext IPO was approved by the Listing Committee, making it the world's first batch of "chipless" IC packaging substrate production enterprises.

On July 16th, Zhuhai Yueya Semiconductor Co., Ltd. (referred to as Yueya Semiconductor) IPO was approved by the listing committee of the Shenzhen Stock Exchange. The sponsor of this IPO is CITIC SEC. According to the prospectus, Yueya Semiconductor is mainly engaged in the research and development, production, and sales of advanced packaging key materials and products. Its main products include IC packaging carriers and embedded packaging modules. It is one of the earliest mainland enterprises in China to produce IC packaging carriers and one of the first in the world to achieve mass production of "core-less" IC packaging carriers using independent patented technology "copper pillar reinforcement method". The RF module carriers, ASIC chip carriers, and embedded packaging modules it produces have strong market competitiveness in related domestic and foreign sub-markets. It is also one of the first domestic manufacturers to complete the R&D of FC-BGA packaging carriers and successfully put them into mass production. The company's main products include IC packaging carriers and embedded packaging modules, with IC packaging carriers products mainly including RF module packaging carriers, ASIC chip packaging carriers, flip chip ball grid array packaging carriers, and power management chip packaging carriers. The company's products are mainly used in RF front-end, high-performance computing, CPU/GPU/ASIC processors, network connections, power management, etc., with terminal applications including portable consumer electronics such as mobile phones and tablets, AI servers, computing centers, and communication base stations. The company uses independent copper pillar technology with proprietary intellectual property rights to achieve industrialization of core-less packaging carriers and has developed a hybrid embedded packaging technology based on copper pillar technology, making it one of the few companies in the world to achieve industrialization of embedded chip technology. It can embed wafers and passive components in the packaging carrier, greatly reducing the packaging area and improving the performance of the packaging module products. The company focuses on the RF front-end and power management analog chip markets, while actively developing the digital chip market represented by high-performance computing demand. It has become a packaging carrier enterprise with certain international competitiveness, with its products recognized by a wide range of high-quality customers at home and abroad such as Qorvo, Texas Instruments, Spreadtrum Communications, Maxscend Microelectronics, Vanchip, and Chiporigin, forming stable supply relationships. With the growth in demand for computing power and high-speed network communication driven by AI technology development, and the continuous deepening of the trends towards electrification and intelligence in automobiles, Yueya Semiconductor adheres to market application-oriented principles and will steadily develop the digital chip market based on consolidating its competitive advantages in the analog chip market. It will gradually expand its product applications from consumer electronics, industrial applications to automotive electronics and strive to become a world-leading provider of IC packaging carrier-related semiconductor modules and semiconductor device solutions. In terms of financials, in the fiscal years 2023, 2024, and 2025, the company's operating revenue was 1.705 billion yuan, 1.796 billion yuan, and 2.089 billion yuan respectively; net profit was 192 million yuan, 207 million yuan, and 307 million yuan respectively.