ASMPT (00522) announced that its net profit for the year 2025 is 902 million Hong Kong dollars, an annual increase of 163.6% after tax.

ASMPT (00522) announced its performance for the year 2025, with sales revenue of HK$145.2 billion (US$18.6 billion), a year-on-year increase of 9.8%. The comprehensive net profit after tax was HK$9.02 billion, a year-on-year increase of 163.6%. Basic earnings per share were HK$2.17, with a final dividend per share of HK$0.34 and a special cash dividend per share of HK$0.79. Driven by artificial intelligence (AI), the company's advanced packaging (AP) business achieved sales revenue of US$5.32 billion, a year-on-year growth of 30.2%, with the most significant contribution coming from Thermo-Compression Bonding (TCB) solutions. The mainstream business of the company saw a year-on-year increase in sales revenue of 3.3%, driven primarily by the demand for data transmission and energy management in AI data centers, as well as the high capacity utilization rates in the Chinese electric vehicle (EV) industry and outsourced semiconductor assembly and test (OSAT) enterprises. However, applications in automotive and industrial markets outside of China remained weak. Driven by TCB, sales revenue for advanced packaging grew by 30.2% year-on-year, with advanced packaging accounting for 26% of the total sales revenue, increasing to 30% by 2025. It is expected that sales revenue in the first quarter of 2026 will be between US$4.7 billion and US$5.3 billion, a median decline of 1.8% on a quarterly basis but a year-on-year increase of 29.5%. The company's forecast for sales revenue in the first quarter of 2026 (for continuing operations only) is higher than current market expectations. The semiconductor solutions division is expected to continue to see growth on a quarterly basis, mainly driven by TCB and high-end bonder sales, offsetting seasonal factors in the surface mount technology solutions division. Year-on-year growth in sales revenue is mainly driven by the strong momentum in the surface mount technology solutions division and stable growth in the semiconductor solutions division. The company expects an improvement in gross margin for the first quarter of 2026, mainly due to increased sales of TCB and high-end bonder driving the gross margin for the semiconductor solutions division back to the 40% median level. However, due to continued weakness in the automotive and industrial end markets, the gross margin for the surface mount technology solutions division will remain at a similar level.