CMSC: Conventional soldering faces challenges in space environments, and tile solutions are expected to be used in space photovoltaics.

CMSC released a research report stating that under the premise of extreme weight reduction and flexibility of space solar photovoltaic cells, traditional soldering connection methods can easily cause silicon wafer damage and desoldering phenomena. The use of a lapped structure can effectively reduce the risk of cell damage and increase the power output per unit area, and may be widely used in space photovoltaics; thus, this may have a significant impact on the conductive paste system. In conclusion, the analysis suggests that lapped component equipment and conductive adhesives may encounter new demand scenarios and will benefit significantly from this. CMSC's main points are as follows: Challenges of traditional soldering in space applications Under the premise of extreme weight reduction and flexibility of space solar photovoltaic cells, ultra-thin silicon wafers are very fragile. After using traditional soldering methods, the high-temperature soldering process and mechanical stress of the solder strip can easily cause silicon wafer fracture. Moreover, due to the large difference in expansion coefficients between silicon and the solder strip, there is a high probability of desoldering under extreme temperature variations in orbit. Therefore, using traditional soldering methods for connecting solar panels in space environments will face significant application challenges. Lapped solutions may see widespread application Using a lapped structure with flexible silicon wafer connections, fewer solder joints, and effective dispersion of mechanical stress, the risk of hidden cracks is minimal. Lapped soldering uses conductive adhesive for low-temperature curing bonding, reducing the risk of cell damage. Additionally, the lapped structure can achieve zero spacing between cell panels and no obstruction from solder strips, increasing the effective power generation area for the same solar panel area, resulting in higher efficiency. In the context of space applications, the high power per unit area and stable mechanical performance characteristics of lapped structures will be further amplified, possibly leading to widespread use in space photovoltaics. Lapped structures have already been proven reliable in space photovoltaics For example, the "Dong Fang Hong 1" satellite launched in 1971 had solar panels with a lapped structure, a combination of lapped and flat panel structures designed in China. Lapped technology has already been proven reliable in space power applications. Companies to watch include ST Jingji, Wuxi Dk Electronic Materials Co., Ltd., Darbond Technology, Polymeric Materials, and Wuxi Autowell Technology Co., Ltd. Risk warning: Unexpected technical route expansion, lower-than-expected downstream demand, intensification of trade barriers, patent risks, etc.