Taosheng Technology's ChiNext IPO has been queried, focusing on the field of semiconductor testing interfaces.

On January 21, Shanghai Taosheng Electronic Technology Co., Ltd. (referred to as Taosheng Technology) applied for a change in the status of its listing review on the Shanghai Stock Exchange's Sci-Tech Innovation Board to "inquiry received." Huatai United Securities is its sponsoring institution, with plans to raise 1.058 billion yuan. The prospectus shows that Taosheng Technology focuses on the semiconductor testing interface field, with main products including chip testing interfaces, probe cards, etc., providing key hardware testing solutions for downstream customers in the chip design, wafer manufacturing, packaging testing, and other areas of the industry chain. The company serves clients in sectors such as artificial intelligence, autonomous driving, and advanced storage, providing a complete set of technical solutions for chip testing interfaces. Its products cover high-end digital chips represented by CPU, GPU, AI chips, and advanced packaging chips represented by 2.5D/3D packaging, CoWoS packaging, PoP packaging, Chiplet packaging. The chip testing interface industry, especially high-end chip testing interfaces, has complex design and manufacturing processes and high barriers to entry. According to data from Yole, in the global chip testing interface industry for 2024, Yamaichi (Japan) ranks first, Yingwei Technology (Taiwan) ranks second, followed by Leeno (South Korea), Cohu (United States), and Enplas (Japan) in the third to fifth places. The company is one of the earliest domestic enterprises to independently develop and produce chip testing interface products. Based on public market data disclosed by Yole, the company's chip testing interface revenue in 2024 ranks first domestically, and based on company sales revenue, it ranks 11th globally in the chip testing interface industry for 2024. During the reporting period, the company's main business income is as follows: In the chip testing interface field, the company has independent research and development and manufacturing capabilities for high-speed high-frequency testing probes, having developed hundreds of test probe technical solutions that can accurately match the testing needs of different chip types. Meanwhile, the company has developed over 4,000 chip testing interface technical solutions during the reporting period, meeting demanding testing requirements for various scenarios including high and low temperatures, durability, high current, high power consumption from research and development to mass production stages. The raised funds will mainly be used for investment in the following projects: Financially, the company achieved operating revenues of approximately 165 million yuan, 209 million yuan, 331 million yuan, and 192 million yuan in the fiscal years of 2022, 2023, 2024, and January to June 2025, respectively. During the same periods, the net profits were 17.41 million yuan, -8.22 million yuan, 12.06 million yuan, 8.37 million yuan, respectively.