Samsung is reportedly going to build a new advanced chip packaging plant to address the explosive demand for AI computing power.

According to the Zhitong Financial APP, Samsung is considering building a chip packaging factory in South Korea as reported by South Korean media. The facility may be located in Gwangju, South Korea, and it is worth noting that SK Hynix is also considering investing in the region. According to sources familiar with the matter, this South Korean technology giant is conducting final reviews of the plan, and it may be announced as early as next month.