Robotechnik Intelligent Technology (03757) plans a global offering of 11.876 million shares, introducing cornerstone investors including Temasek and E Fund.

Robotechnik Intelligent Technology (03757) is conducting a public offering from September 21, 2026 to September 24, 2026, and plans a global offering of 11.876 million H shares, with approximately 10.0% under the Hong Kong public offering and approximately 90.0% under the international offering, plus an over-allotment option of approximately 15%. The offer price will not exceed HK$436.00 per offer share, with a board lot of 50 shares, and the H shares are expected to commence trading on the Stock Exchange at 9:00 a.m. on September 29, 2026. It is understood that the company is a global supplier of manufacturing equipment and systems for the photovoltaic industry and the silicon photonics industry. The company's photovoltaic manufacturing solutions include (i) photovoltaic manufacturing equipment, primarily comprising automation equipment for photovoltaic cell production that performs functions such as silicon wafer loading and unloading; (ii) complete production lines, in which the company integrates its own equipment with equipment procured from third-party suppliers as needed, together with related design, configuration, and installation services, to provide complete solutions tailored to customers' specific needs; and (iii) intelligent manufacturing systems, a software-centric solution built around the company's proprietary R2FabMES platform to enable automated factory operations at customers' production facilities. Since the company's initial minority equity investment in ficonTEC in 2020 and its full acquisition of ficonTEC in 2025, the company has continuously advanced the development of intelligent manufacturing equipment for silicon photonic devices. Through ficonTEC, the company offers two major product lines: assembly equipment and testing equipment, which, according to CIC, cover the key stages of silicon photonics assembly and testing. The company's assembly equipment can precisely position the components of silicon photonic devices and secure them together using bonding technology, with applications spanning standalone systems, inline systems, and fiber preparation systems, and can support gradual expansion from the R&D stage to high-volume production. The company's testing equipment can perform electrical, optical, and mixed-signal optoelectronic testing and characterization of silicon photonic devices at the wafer, die, chip, and module levels throughout the entire manufacturing process. According to CIC, based on 2025 revenue, the company ranked fifth globally in the field of intelligent photovoltaic cell automated manufacturing equipment, with a market share of 2.6%, and based on 2025 revenue, ranked first globally in the field of silicon photonics intelligent manufacturing equipment, with a market share of 20.5%. Based on the maximum offer price of HK$436.00 per offer share, the net proceeds from the global offering (assuming the over-allotment option and the offer size adjustment right are not exercised) are approximately HK$4.961 billion. Of this, approximately 20.0% will be used to strengthen product and technology research and development and innovation. The company will continue to invest in nanoscale-precision silicon photonics assembly and testing equipment and photovoltaic manufacturing solutions, focusing on commercializing advanced technologies and driving continuous iteration. Approximately 40.0% will be used to expand production capacity and improve delivery speed to address the AI-driven accelerating demand for high-performance computing and high-speed data transmission. Approximately 10.0% will be used to establish a global sales and service network to deepen customer engagement, expand market penetration, and improve after-sales responsiveness in key regions. Approximately 20.0% will be used for strategic investments and/or acquisitions to capture opportunities that have synergies with the company's core business and can enhance the company's technology pipeline, product portfolio, and market access. Approximately 10.0% will be used as working capital and for other general corporate purposes, including daily operations and general corporate expenses, to provide financial flexibility as the business grows. In addition, the company has entered into cornerstone investment agreements with cornerstone investors, pursuant to which the cornerstone investors have agreed, subject to certain conditions, to subscribe for or cause their designated entities to subscribe for the relevant number of offer shares at the offer price, for an aggregate amount of approximately US$232.4 million. The cornerstone investors include: Temasek Holdings (Private) Limited, Shengtian Industrial Group (Hong Kong) Limited, Ivy Asset Management (Hong Kong) Limited, E Fund Management Co., Ltd., E Fund Management (Hong Kong) Co., Limited, Shanghai Cig Shanghai Co., Ltd., Victory Privilege Fund OFC-Winner Global Fund, Wind Sabre Fund SPC, Chengheng International Group Limited, Arrowpoint Master Fund, Stable Growth Fund SP, Lu Hua Asset Management Limited, Bloom Capital Limited, Mr. Lai Pak Lam, Mr. Xia Shengli, Mr. Zhu Guodong, and Mr. Zheng Xiaofeng.